{"id":125,"date":"2017-10-06T10:30:51","date_gmt":"2017-10-06T10:30:51","guid":{"rendered":"https:\/\/www.cumi-murugappa.com\/emd\/?page_id=125"},"modified":"2018-07-02T10:04:25","modified_gmt":"2018-07-02T10:04:25","slug":"wire-sawing","status":"publish","type":"page","link":"https:\/\/www.cumi-murugappa.com\/emd\/applications\/wire-sawing\/","title":{"rendered":"Wire Sawing"},"content":{"rendered":"<p>Wire sawing is a method for slicing and cutting silicon wafers. In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wire sawing is commonly used in the silicon wafer production.<\/p>\n<p><a href=\"https:\/\/www.cumi-murugappa.com\/emd\/silicon-carbide-powders-micro-grit\/\">CUMISLICE<\/a> &#8211; Premium micro grit for slicing silicon wafers is classified to narrow customized size distributions, offers the benefits of predictable performance in wafer slicing.<\/p>\n<p><img decoding=\"async\" loading=\"lazy\" width=\"250\" height=\"80\" src=\"https:\/\/www.cumi-murugappa.com\/emd\/wp-content\/uploads\/2018\/06\/cumi-slice.jpg\" class=\"alignnone size-full wp-image-983\" \/><\/p>\n<h5>This product is critically designed and tailored to yield:<\/h5>\n<ul class=\"list-unstyled\">\n<li>Desired wafer thickness<\/li>\n<li>Close TTV distribution<\/li>\n<li>Superior surface quality<\/li>\n<li>Low kerf loss<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Wire sawing is a method for slicing and cutting silicon wafers. In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wire sawing is commonly used in the silicon wafer production. CUMISLICE &#8211; Premium micro grit &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.cumi-murugappa.com\/emd\/applications\/wire-sawing\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Wire Sawing&#8221;<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":570,"parent":84,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-application.php","meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v20.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Wire Sawing - CUMI EMD<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.cumi-murugappa.com\/emd\/applications\/wire-sawing\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Wire Sawing - CUMI EMD\" \/>\n<meta property=\"og:description\" content=\"Wire sawing is a method for slicing and cutting silicon wafers. In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wire sawing is commonly used in the silicon wafer production. 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In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wire sawing is commonly used in the silicon wafer production. 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