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https://www.cumi-murugappa.com/emd/wp-content/uploads/2017/11/wire-banner.jpg1500250Wire sawing is a method for slicing and cutting silicon wafers. In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wire sawing is commonly used in the silicon wafer production. CUMISLICE – Premium micro grit … Continue reading ""